Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Kabir Mirpuri, Betty Hill-Shan Yeung | 2025-09-02 |
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Kabir Mirpuri | 2024-03-19 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Kabir Mirpuri, Betty Hill-Shan Yeung | 2023-11-14 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Kabir Mirpuri | 2023-01-17 |
| 11222790 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2022-01-11 |