Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim +2 more | 2020-01-07 |
| 10043730 | Stacked silicon package assembly having an enhanced lid | Gamal Refai-Ahmed, Tien-Yu Lee, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh +1 more | 2018-08-07 |