Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257795 | Chip-scale LED package structure | Tien-Yu Lee, Chih-Yuan Chen, Wei-Lun Tsai, Wei-Hsun Hsu, Wei-Chien HUNG | 2022-02-22 |
| D668233 | LED package | Chun-Chang Wu, Wen-Kai Chang | 2012-10-02 |
| 7468326 | Method of cleaning a wafer | Ming-Te Chen, Yi-Ching Wu | 2008-12-23 |
| 7229896 | STI process for eliminating silicon nitride liner induced defects | Ming-Te Chen, Yi-Ching Wu | 2007-06-12 |