Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6352192 | System and method to control solder reflow furnace with wafer surface characterization | Tien-Yu Lee, Li Li | 2002-03-05 |
| 6081037 | Semiconductor component having a semiconductor chip mounted to a chip mount | Tien-Yu Lee | 2000-06-27 |
| 5436197 | Method of manufacturing a bonding pad structure | — | 1995-07-25 |