Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861720 | Placement template and method for placing optical dies | Stephen G. Shermer | 2005-03-01 |
| 5467253 | Semiconductor chip package and method of forming | Francis J. Carney, Harry J. Geyer | 1995-11-14 |
| 5307981 | Method and apparatus for optimizing bond tool pressure distribution | Mark C. Hoggatt | 1994-05-03 |