Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5596172 | Planar encapsulation process | Glenn D. Raskin, Setsuko J. Cole | 1997-01-21 |
| 5307981 | Method and apparatus for optimizing bond tool pressure distribution | James K. Heckman | 1994-05-03 |
| 5142117 | Proximity heater for an ultrasonic bonding tool | Arun Narayanan | 1992-08-25 |