RB

Rajesh Baskaran

Applied Materials: 5 patents #2,165 of 7,310Top 30%
MH Macom Technology Solutions Holdings: 5 patents #34 of 265Top 15%
SE Semitool: 3 patents #59 of 141Top 45%
Overall (All Time): #372,465 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11676860 Barrier for preventing eutectic break-through in through-substrate vias Allen W. Hanson, Timothy E. Boles 2023-06-13
10855230 FET operational temperature determination by field plate resistance thermometry Simon J. Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Frank Gao 2020-12-01
10790787 FET operational temperature determination by gate structure resistance thermometry Simon J. Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Bryan Schwitter 2020-09-29
10147642 Barrier for preventing eutectic break-through in through-substrate vias Allen W. Hanson, Timothy E. Boles 2018-12-04
9234293 Electrolytic copper process using anion permeable barrier Robert W. Batz, Jr., Bioh Kim, Thomas Ritzdorf, John L. Klocke, Kyle M. Hanson 2016-01-12
8961771 Electrolytic process using cation permeable barrier Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson 2015-02-24
8928133 Interlocking type solder connections for alignment and bonding of wafers and/or substrates 2015-01-06
8852417 Electrolytic process using anion permeable barrier Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson 2014-10-07
8236159 Electrolytic process using cation permeable barrier Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson 2012-08-07
8123926 Electrolytic copper process using anion permeable barrier Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson 2012-02-28
7628898 Method and system for idle state operation John L. Klocke, Kyle M. Hanson 2009-12-08
7252714 Apparatus and method for thermally controlled processing of microelectronic workpieces Kyle M. Hanson, Robert W. Batz, Jr., Nolan L. Zimmerman, Zhongmin Hu, Gregory J. Wilson +1 more 2007-08-07
7135404 Method for applying metal features onto barrier layers using electrochemical deposition Bioh Kim, Linlin Chen, Lyndon Graham 2006-11-14