Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676860 | Barrier for preventing eutectic break-through in through-substrate vias | Allen W. Hanson, Timothy E. Boles | 2023-06-13 |
| 10855230 | FET operational temperature determination by field plate resistance thermometry | Simon J. Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Frank Gao | 2020-12-01 |
| 10790787 | FET operational temperature determination by gate structure resistance thermometry | Simon J. Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Bryan Schwitter | 2020-09-29 |
| 10147642 | Barrier for preventing eutectic break-through in through-substrate vias | Allen W. Hanson, Timothy E. Boles | 2018-12-04 |
| 9234293 | Electrolytic copper process using anion permeable barrier | Robert W. Batz, Jr., Bioh Kim, Thomas Ritzdorf, John L. Klocke, Kyle M. Hanson | 2016-01-12 |
| 8961771 | Electrolytic process using cation permeable barrier | Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2015-02-24 |
| 8928133 | Interlocking type solder connections for alignment and bonding of wafers and/or substrates | — | 2015-01-06 |
| 8852417 | Electrolytic process using anion permeable barrier | Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2014-10-07 |
| 8236159 | Electrolytic process using cation permeable barrier | Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2012-08-07 |
| 8123926 | Electrolytic copper process using anion permeable barrier | Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2012-02-28 |
| 7628898 | Method and system for idle state operation | John L. Klocke, Kyle M. Hanson | 2009-12-08 |
| 7252714 | Apparatus and method for thermally controlled processing of microelectronic workpieces | Kyle M. Hanson, Robert W. Batz, Jr., Nolan L. Zimmerman, Zhongmin Hu, Gregory J. Wilson +1 more | 2007-08-07 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition | Bioh Kim, Linlin Chen, Lyndon Graham | 2006-11-14 |