Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11236094 | Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors | Yikai Wang, Yang Zhang, Zhengxia Chen, Tao Feng, Rongxin HUANG +7 more | 2022-02-01 |
| 11130761 | Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors | Yang Zhang, Yikai Wang, Tao Feng, Guoping HU, Jian Li +1 more | 2021-09-28 |
| D828342 | Smart home hub | — | 2018-09-11 |
| 7462269 | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas | 2008-12-09 |
| 7332066 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece | Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas Ritzdorf | 2008-02-19 |
| 7198705 | Plating-rinse-plating process for fabricating copper interconnects | Jiong-Ping Lu, Changfeng Xia | 2007-04-03 |
| 7144805 | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | Lyndon Graham, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. | 2006-12-05 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition | Rajesh Baskaran, Bioh Kim, Lyndon Graham | 2006-11-14 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece | Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas Ritzdorf | 2006-10-03 |
| 7067015 | Modified clean chemistry and megasonic nozzle for removing backside CMP slurries | Changfeng Xia | 2006-06-27 |
| 7048841 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Robert W. Batz, Jr., John M. Pedersen, John L. Klocke | 2006-05-23 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas | 2006-02-21 |
| 6998275 | Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application | Jin Zhao, M. Grant Albrecht, Qidu Jiang | 2006-02-14 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas | 2006-02-07 |
| 6939448 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Robert W. Batz, Jr., John M. Pedersen, John L. Klocke | 2005-09-06 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | Thomas C. Taylor | 2005-08-23 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece | — | 2005-07-19 |
| 6911127 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | Robert W. Batz, Jr., John M. Pedersen, John L. Klocke | 2005-06-28 |
| 6908851 | Corrosion resistance for copper interconnects | Yaojian Leng | 2005-06-21 |
| 6899805 | Automated chemical management system executing improved electrolyte analysis method | Lyndon Graham | 2005-05-31 |
| 6869510 | Methods and apparatus for processing the surface of a microelectronic workpiece | Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila | 2005-03-22 |
| 6811675 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece | — | 2004-11-02 |
| 6806186 | Submicron metallization using electrochemical deposition | Lyndon Graham, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. | 2004-10-19 |
| 6743719 | Method for forming a conductive copper structure | Jiong-Ping Lu, Changfeng Xia | 2004-06-01 |
| 6730597 | Pre-ECD wet surface modification to improve wettability and reduced void defect | Jiong-Ping Lu, David Gonzalez, Honglin Guo | 2004-05-04 |