| 11236094 |
Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors |
Yikai Wang, Yang Zhang, Zhengxia Chen, Tao Feng, Rongxin HUANG +7 more |
2022-02-01 |
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| 11130761 |
Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors |
Yang Zhang, Yikai Wang, Tao Feng, Guoping HU, Jian Li +1 more |
2021-09-28 |
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| D828342 |
Smart home hub |
— |
2018-09-11 |
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| 7462269 |
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas |
2008-12-09 |
$1,766,000 |
| 7332066 |
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas Ritzdorf |
2008-02-19 |
$2,542,000 |
| 7198705 |
Plating-rinse-plating process for fabricating copper interconnects |
Jiong-Ping Lu, Changfeng Xia |
2007-04-03 |
$7,574,000 |
| 7144805 |
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
Lyndon Graham, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. |
2006-12-05 |
$1,506,000 |
| 7135404 |
Method for applying metal features onto barrier layers using electrochemical deposition |
Rajesh Baskaran, Bioh Kim, Lyndon Graham |
2006-11-14 |
$4,531,000 |
| 7115196 |
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas Ritzdorf |
2006-10-03 |
$1,688,000 |
| 7067015 |
Modified clean chemistry and megasonic nozzle for removing backside CMP slurries |
Changfeng Xia |
2006-06-27 |
$13,099,000 |
| 7048841 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
Robert W. Batz, Jr., John M. Pedersen, John L. Klocke |
2006-05-23 |
$2,702,000 |
| 7001471 |
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas |
2006-02-21 |
$1,432,000 |
| 6998275 |
Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application |
Jin Zhao, M. Grant Albrecht, Qidu Jiang |
2006-02-14 |
$19,296,000 |
| 6994776 |
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas |
2006-02-07 |
$3,397,000 |
| 6939448 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
Robert W. Batz, Jr., John M. Pedersen, John L. Klocke |
2005-09-06 |
$2,545,000 |
| 6932892 |
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
Thomas C. Taylor |
2005-08-23 |
$2,716,000 |
| 6919013 |
Apparatus and method for electrolytically depositing copper on a workpiece |
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2005-07-19 |
$3,167,000 |
| 6911127 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
Robert W. Batz, Jr., John M. Pedersen, John L. Klocke |
2005-06-28 |
$3,338,000 |
| 6908851 |
Corrosion resistance for copper interconnects |
Yaojian Leng |
2005-06-21 |
$18,135,000 |
| 6899805 |
Automated chemical management system executing improved electrolyte analysis method |
Lyndon Graham |
2005-05-31 |
$1,672,000 |
| 6869510 |
Methods and apparatus for processing the surface of a microelectronic workpiece |
Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila |
2005-03-22 |
$1,261,000 |
| 6811675 |
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
— |
2004-11-02 |
$3,642,000 |
| 6806186 |
Submicron metallization using electrochemical deposition |
Lyndon Graham, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. |
2004-10-19 |
$1,078,000 |
| 6743719 |
Method for forming a conductive copper structure |
Jiong-Ping Lu, Changfeng Xia |
2004-06-01 |
$25,423,000 |
| 6730597 |
Pre-ECD wet surface modification to improve wettability and reduced void defect |
Jiong-Ping Lu, David Gonzalez, Honglin Guo |
2004-05-04 |
$10,969,000 |