Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

US Patent 6932892 · Granted Aug 23, 2005

Estimated economic value: $2,716,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors2022
Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors2021
Smart home hub2018
Space transportation node including tether system2010
Flat valve for orbital applications2009
Propellant depot in space2009
Large cryogenic tank logistics for in-space vehicles2009
Space transportation node including tether system2009
Method for low temperature annealing of metallization micro-structures in the pr2008
Platform and system for mass storage and transfer in space2008
System for use of external secondary payloads2008
Apparatus and method for electrochemically depositing metal on a semiconductor w2008