LC

Linlin Chen

SE Semitool: 29 patents #10 of 141Top 8%
TI Texas Instruments: 6 patents #2,401 of 12,488Top 20%
📍 Nanhu, MT: #1 of 1 inventorsTop 100%
Overall (All Time): #82,507 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
6699373 Apparatus for processing the surface of a microelectronic workpiece Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila 2004-03-02
6645356 Methods and apparatus for processing the surface of a microelectronic workpiece Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila 2003-11-11
6638410 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece Thomas C. Taylor 2003-10-28
6632345 Apparatus and method for electrolytically depositing a metal on a workpiece 2003-10-14
6565729 Method for electrochemically depositing metal on a semiconductor workpiece Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas Ritzdorf 2003-05-20
6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Robert W. Batz, Jr., John M. Pedersen, John L. Klocke 2003-03-04
6508920 Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device Thomas Ritzdorf, E. Henry Stevens, Lyndon Graham, Curt Dundas 2003-01-21
6309524 Methods and apparatus for processing the surface of a microelectronic workpiece Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila 2001-10-30
6309520 Methods and apparatus for processing the surface of a microelectronic workpiece Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila 2001-10-30
6306276 Aqueous electrodeposition of rare earth and transition metals Ken Nobe, Morton I. Schwartz, No Sang Myung 2001-10-23
6303010 Methods and apparatus for processing the surface of a microelectronic workpiece Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, John M. Pedersen, Vladimir Zila 2001-10-16
6290833 Method for electrolytically depositing copper on a semiconductor workpiece 2001-09-18
6277263 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece 2001-08-21
6197181 Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece 2001-03-06