Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for electrolytically depositing copper on a workpiece

Apparatus and method for electrolytically depositing copper on a workpiece

US Patent 6919013 · Granted Jul 19, 2005

Estimated economic value: $3,167,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors2022
Substituted pyrrolo[2,1-f][1,2,4]triazines as FGFR inhibitors2021
Smart home hub2018
Method for low temperature annealing of metallization micro-structures in the pr2008
Apparatus and method for electrochemically depositing metal on a semiconductor w2008
Plating-rinse-plating process for fabricating copper interconnects2007
Method of submicron metallization using electrochemical deposition of recesses i2006
Method for applying metal features onto barrier layers using electrochemical dep2006
Apparatus and method for electrochemically depositing metal on a semiconductor w2006
Modified clean chemistry and megasonic nozzle for removing backside CMP slurries2006
Contact assemblies, methods for making contact assemblies, and plating machines 2006
Method and apparatus for low-temperature annealing of metallization microstructu2006