Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for controlling semiconductor workpiece surface exposure to processing liquids

Methods for controlling semiconductor workpiece surface exposure to processing liquids

US Patent 6090711 · Granted Jul 18, 2000

Estimated economic value: $5,532,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electroplating tool with feedback of metal thickness distribution and correction2019
Electrolytic copper process using anion permeable barrier2016
System for manufacturing a reinforcement2015
Electrolytic process using cation permeable barrier2015
Electrolytic process using anion permeable barrier2014
Method for manufacturing a reinforcement2014
Electrolytic process using cation permeable barrier2012
Electrolytic copper process using anion permeable barrier2012
Formation of silicon nitride layer on back side of substrate2010
Apparatus and method for thermally controlled processing of microelectronic work2007
Method of submicron metallization using electrochemical deposition of recesses i2006
Contact assemblies, methods for making contact assemblies, and plating machines 2006