Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6747734 | Apparatus and method for processing a microelectronic workpiece using metrology | Steve Eudy, Gregory J. Wilson, Paul R. McHugh | 2004-06-08 |
| 6669834 | Method for high deposition rate solder electroplating on a microelectronic workpiece | Robert W. Batz, Jr., Scot Conrady | 2003-12-30 |
| 6599412 | In-situ cleaning processes for semiconductor electroplating electrodes | Lyndon Graham, Jeffrey I. Turner | 2003-07-29 |
| 6592736 | Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath | Dakin Fulton | 2003-07-15 |
| 6565729 | Method for electrochemically depositing metal on a semiconductor workpiece | Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2003-05-20 |
| 6551479 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath | Lyndon Graham, Thomas C. Taylor, Fredrick A. Lindberg, Bradley C. Carpenter | 2003-04-22 |
| 6508920 | Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | E. Henry Stevens, Linlin Chen, Lyndon Graham, Curt Dundas | 2003-01-21 |
| 6454926 | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas | Jeffrey I. Turner, Robert W. Berner | 2002-09-24 |
| 6428673 | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology | Steve Eudy, Gregory J. Wilson, Paul R. McHugh | 2002-08-06 |
| 6365033 | Methods for controlling and/or measuring additive concentration in an electroplating bath | Lyndon Graham, Thomas C. Taylor, Fredrick A. Lindberg, Bradley C. Carpenter | 2002-04-02 |
| 6334937 | Apparatus for high deposition rate solder electroplating on a microelectronic workpiece | Robert W. Batz, Jr., Scot Conrady | 2002-01-01 |
| 6270647 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations | Lyndon Graham, Kyle M. Hanson, Jeffrey I. Turner | 2001-08-07 |
| 6099712 | Semiconductor plating bowl and method using anode shield | Jeffrey I. Turner, Lyndon Graham | 2000-08-08 |