Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289387 | Methods and apparatus for backside via reveal processing | Prayudi Lianto, Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan +10 more | 2022-03-29 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Peng Suo, Prayudi Lianto, Arvind Sundarrajan | 2020-04-28 |
| 10515927 | Methods and apparatus for semiconductor package processing | Prayudi Lianto, Arvind Sundarrajan, Ranga Rao Arnepalli, Prerna Goradia | 2019-12-24 |
| 10475735 | Methods and apparatus for 3D MIM capacitor package processing | Peng Suo, Arvind Sundarrajan | 2019-11-12 |
| 10319601 | Slurry for polishing of integrated circuit packaging | Ranga Rao Arnepalli, Prerna Goradia, Prayudi Lianto, Jie Zeng, Arvind Sundarrajan +1 more | 2019-06-11 |
| 10276424 | Method and apparatus for wafer level packaging | Yu Gu, Arvind Sundarrajan | 2019-04-30 |
| 10229827 | Method of redistribution layer formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Yu Gu, Arvind Sundarrajan | 2019-03-12 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Yu Gu, Arvind Sundarrajan +3 more | 2019-02-19 |
| 10062710 | Integrated circuits with deep and ultra shallow trench isolations and methods for fabricating the same | Rui Tze Toh, Shaoqiang Zhang, Purakh Raj Verma | 2018-08-28 |
| 10020394 | Extended drain metal-oxide-semiconductor transistor | Rui Tze Toh, Shaoqiang Zhang, Purakh Raj Verma | 2018-07-10 |
| 10002771 | Methods for chemical mechanical polishing (CMP) processing with ozone | Prayudi Lianto, Kuma Hsiung, Eric J. Bergman, John L. Klocke, Mohamed Rafi +2 more | 2018-06-19 |
| 9954051 | Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring | Chin Hock Toh, Glen T. Mori, Arvind Sundarrajan | 2018-04-24 |
| 9922874 | Methods of enhancing polymer adhesion to copper | Prayudi Lianto, Sam Lee, Charles Sharbono, Marvin L. Bernt, Arvind Sundarrajan | 2018-03-20 |
| 9922868 | Integrated circuits using silicon on insulator substrates and methods of manufacturing the same | Rui Tze Toh, Shaoqiang Zhang, Raj Verma Purakh | 2018-03-20 |
| 9899514 | Extended drain metal-oxide-semiconductor transistor | Rui Tze Toh, Shaoqiang Zhang, Purakh Raj Verma | 2018-02-20 |
| 9685364 | Silicon-on-insulator integrated circuit devices with body contact structures and methods for fabricating the same | Rui Tze Toh, Shaoqiang Zhang, Purakh Raj Verma | 2017-06-20 |
| 9472512 | Integrated circuits with contacts through a buried oxide layer and methods of producing the same | Rui Tze Toh, Shaoqiang Zhang, Purakh Raj Verma | 2016-10-18 |
| 9230990 | Silicon-on-insulator integrated circuit devices with body contact structures | Shaoqiang Zhang, Purakh Raj Verma | 2016-01-05 |
| 9087906 | Grounding of silicon-on-insulator structure | Purakh Raj Verma, Shaoqiang Zhang, Bo Yu, Rui Tze Toh, Tao Jiang | 2015-07-21 |
| 8946819 | Silicon-on-insulator integrated circuits with local oxidation of silicon and methods for fabricating the same | Shaoqiang Zhang, Purakh Raj Verma, Youzhou Hu, Wenli Liu | 2015-02-03 |