Issued Patents All Time
Showing 1–25 of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418009 | Bonded semiconductor structure and method for forming the same | Su Xing, Shyam Parthasarathy | 2025-09-16 |
| 12363921 | Method for fabricating inductor module | Su Xing, Shyam Parthasarathy, Xiao Yuan Zhi | 2025-07-15 |
| 12324168 | Semiconductor device and manufacturing method thereof | Ching-Yang Wen, Chee-Hau Ng, Chin-Wei Ho | 2025-06-03 |
| 12300534 | Method of forming protective layer utilized in silicon remove process | Chia-Liang Liao, Chee-Hau Ng, Ching-Yang Wen | 2025-05-13 |
| 12249545 | Integrated circuit device | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2025-03-11 |
| 12191367 | Multi-finger transistor structure and method of manufacturing the same | Su Xing, Rudy Octavius Sihombing, Shyam Parthasarathy, Jinyu Liao | 2025-01-07 |
| 12191195 | Method of fabricating an air gap | Bo Tao, Runshun Wang, Li-Cih Wang, Ching-Yang Wen, Dong Yin +1 more | 2025-01-07 |
| 12132011 | Integrated circuit device and fabrication method thereof | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2024-10-29 |
| 12131976 | Semiconductor structure with heat dissipation structure and method of fabricating the same | Kuo-Yuh Yang, Chia-Huei Lin | 2024-10-29 |
| 12087712 | Method for fabricating an integrated circuit device | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2024-09-10 |
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Ching-Yang Wen, Chee-Hau Ng | 2024-09-03 |
| 12046659 | Semiconductor structure and manufacturing method thereof | Su Xing | 2024-07-23 |
| 11955292 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Ching-Yang Wen, Xingxing Chen, Chao Jin | 2024-04-09 |
| 11929213 | Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same | Ching-Yang Wen, Xingxing Chen, Chao Jin | 2024-03-12 |
| 11923373 | Semiconductor structure | Bo Tao, Li-Cih Wang, Ching-Yang Wen, Zhibiao Zhou, Dong Yin +2 more | 2024-03-05 |
| 11881529 | Semiconductor device and method of fabricating the same | Ching-Yang Wen, Li-Cih Wang, Kai Cheng | 2024-01-23 |
| 11848253 | Semiconductor structure with an air gap | Ching-Pin Hsu, Chih-Jung Wang, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin | 2023-12-19 |
| 11721757 | Semiconductor device | Chia-Huei Lin, Kuo-Yuh Yang | 2023-08-08 |
| 11721772 | Varactor with meander diffusion region | Su Xing | 2023-08-08 |
| 11715709 | Manufacturing method of radiofrequency device including mold compound layer | Wen-Shen Li, Ching-Yang Wen | 2023-08-01 |
| 11676992 | Inductor module and method for fabricating the same | Su Xing, Shyam Parthasarathy, Xiao Yuan Zhi | 2023-06-13 |
| 11670567 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Ching-Yang Wen, Chee-Hau Ng | 2023-06-06 |
| 11658087 | High resistivity wafer with heat dissipation structure and method of making the same | Kuo-Yuh Yang, Chia-Huei Lin | 2023-05-23 |
| 11658118 | Transistor structure in low noise amplifier | Chia-Huei Lin, Kuo-Yuh Yang | 2023-05-23 |
| 11652017 | High resistivity wafer with heat dissipation structure and method of making the same | Kuo-Yuh Yang, Chia-Huei Lin | 2023-05-16 |