Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300534 | Method of forming protective layer utilized in silicon remove process | Chee-Hau Ng, Ching-Yang Wen, Purakh Raj Verma | 2025-05-13 |
| 12278210 | Manufacturing method of semiconductor structure | Sheng Zhang, Kai Zhu, Chien-Kee Pang | 2025-04-15 |
| 12080622 | Semiconductor structure and method of wafer bonding | Purakh Raj Verma, Ching-Yang Wen, Chee-Hau Ng | 2024-09-03 |
| 11670567 | Semiconductor structure and method of wafer bonding | Purakh Raj Verma, Ching-Yang Wen, Chee-Hau Ng | 2023-06-06 |
| 10795255 | Method of forming layout definition of semiconductor device | Wei-Lun Hsu, Gang-Yi Lin, Yu-Hsiang Hung, Ying-Chih Lin, Feng-Yi Chang +3 more | 2020-10-06 |
| 10658366 | Semiconductor device and method for fabricating the same | Feng-Yi Chang, Fu-Che Lee, Chieh-Te Chen, Yi-Wang Zhan | 2020-05-19 |
| 10535610 | Semiconductor structure | Feng-Yi Chang, Fu-Che Lee, Yi-Wang Zhan, Yu-Cheng Tung, Chien-Hao Chen +1 more | 2020-01-14 |