| 12419081 |
Silicon-on-insulator substrate and method of manufacturing the same |
Chunyuan Qi, Sheng Zhang, Xingxing Chen |
2025-09-16 |
| 12278210 |
Manufacturing method of semiconductor structure |
Sheng Zhang, Kai Zhu, Chia-Liang Liao |
2025-04-15 |
| 12266578 |
Chips bonding auxiliary structure |
Sheng Zhang, Xin Zhao |
2025-04-01 |
| 12249607 |
Semiconductor structure |
Sheng Zhang, Chunyuan Qi, Xingxing Chen |
2025-03-11 |
| 11605648 |
Semiconductor structure and manufacturing method thereof |
Sheng Zhang, Chunyuan Qi, Xingxing Chen |
2023-03-14 |
| 11456221 |
Method for measuring chips bonding strength and chips bonding auxiliary structure |
Sheng Zhang, Xin Zhao |
2022-09-27 |
| 10622253 |
Manufacturing method of semiconductor device |
Li-Da Huang, Wei Gao, Wen-Bo Ding, Sheng Zhang, Wen-Shen Li +2 more |
2020-04-14 |
| 10580823 |
Wafer level packaging method |
Sheng Zhang, Wen-Bo Ding, Zhi-Rui Sheng, Chien-En Hsu |
2020-03-03 |
| 9852912 |
Method of manufacturing semiconductor device for reducing grain size of polysilicon |
Sheng Zhang, Liang Yi, Wen-Bo Ding, Yu-Yang Chen |
2017-12-26 |
| 9780101 |
Flash cell structure and method of fabricating the same |
Sheng Zhang, Wenbo Ding, Xiaofei Han, Yu-Yang Chen, Jubao Zhang |
2017-10-03 |