Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12324168 | Semiconductor device and manufacturing method thereof | Purakh Raj Verma, Ching-Yang Wen, Chin-Wei Ho | 2025-06-03 | |
| 12300534 | Method of forming protective layer utilized in silicon remove process | Chia-Liang Liao, Ching-Yang Wen, Purakh Raj Verma | 2025-05-13 | |
| 12080622 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Ching-Yang Wen | 2024-09-03 | $696,000 |
| 11670567 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Ching-Yang Wen | 2023-06-06 | $2,259,000 |
| 11398548 | Semiconductor device | Wen-Shen Li, Ching-Yang Wen, Purakh Raj Verma, Xingxing Chen | 2022-07-26 | $7,590,000 |
| 10903314 | Semiconductor device and method for manufacturing the same | Wen-Shen Li, Ching-Yang Wen, Purakh Raj Verma, Xingxing Chen | 2021-01-26 | $1,644,000 |
| 10622253 | Manufacturing method of semiconductor device | Li-Da Huang, Wei Gao, Chien-Kee Pang, Wen-Bo Ding, Sheng Zhang +2 more | 2020-04-14 | $301,000 |