Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281258 | Chip scale packages and related methods | Soon Wei WANG, How Kiat Liew | 2016-03-08 |
| 9018044 | Chip-on-lead package and method of forming | Atapol Prajuckamol, Jun Keat Lee | 2015-04-28 |
| 8759978 | Chip-on-lead package and method of forming | Atapol Prajuckamol, Jun Keat Lee | 2014-06-24 |