Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424522 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2025-09-23 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Eiji KUROSE | 2025-07-29 |
| 12243810 | Semiconductor package with wettable flank and related methods | Hui Min LER, Chee Hiong CHEW | 2025-03-04 |
| 12176272 | Semiconductor package with wettable flank | Hui Min LER, Chee Hiong CHEW | 2024-12-24 |
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Eiji KUROSE | 2024-07-16 |
| 11908699 | Semiconductor packages with die including cavities | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2024-02-20 |
| 11901184 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2024-02-13 |
| 11894234 | Semiconductor packages with die support structure for thin die | Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2024-02-06 |
| 11721654 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Shutesh Krishnan | 2023-08-08 |
| 11532539 | Semiconductor package with wettable flank | Hui Min LER, Chee Hiong CHEW | 2022-12-20 |
| 11508679 | Polymer resin and compression mold chip scale package | Yusheng LIN, Chee Hiong CHEW, Francis J. Carney | 2022-11-22 |
| 11404276 | Semiconductor packages with thin die and related methods | Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2022-08-02 |
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Eiji KUROSE | 2022-08-02 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Francis J. Carney, Eiji KUROSE, Chee Hiong CHEW | 2022-06-14 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Eiji KUROSE | 2022-05-24 |
| 10971429 | Method for forming a semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2021-04-06 |
| 10930604 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Shutesh Krishnan | 2021-02-23 |
| 10916485 | Molded wafer level packaging | Jin Yoong LIONG, Chee Hiong CHEW, Francis J. Carney | 2021-02-09 |
| 10825754 | Quad flat no leads package with locking feature | How Kiat Liew, Jose Felixminia PALAGUD, JR. | 2020-11-03 |
| 10825786 | Polymer resin and compression mold chip scale package | Yusheng LIN, Chee Hiong CHEW, Francis J. Carney | 2020-11-03 |
| 10756006 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2020-08-25 |
| 10607920 | Semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2020-03-31 |
| 10607921 | Method for forming a semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2020-03-31 |