Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825754 | Quad flat no leads package with locking feature | Soon Wei WANG, How Kiat Liew | 2020-11-03 |
| 10438877 | Multi-chip packages with stabilized die pads | Soon Wei WANG | 2019-10-08 |