Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916485 | Molded wafer level packaging | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2021-02-09 |
| 10559510 | Molded wafer level packaging | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2020-02-11 |