Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559510 | Molded wafer level packaging | Jin Yoong LIONG, Chee Hiong CHEW, Francis J. Carney | 2020-02-11 |
| 10438877 | Multi-chip packages with stabilized die pads | Jose Felixminia PALAGUD, JR. | 2019-10-08 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Chee Hiong CHEW, Francis J. Carney | 2019-05-07 |
| 10199311 | Leadless semiconductor packages, leadframes therefor, and methods of making | Darrell D. Truhitte, Chee Hiong CHEW | 2019-02-05 |
| 10177074 | Flexible semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2019-01-08 |
| 9748163 | Die support for enlarging die size | How Kiat Liew, Chee Hiong CHEW, Francis J. Carney | 2017-08-29 |
| 9281258 | Chip scale packages and related methods | Bih Wen Fon, How Kiat Liew | 2016-03-08 |
| 8449339 | Connector assembly and method of manufacture | Shutesh Krishnan | 2013-05-28 |
| 8451621 | Semiconductor component and method of manufacture | Shutesh Krishnan | 2013-05-28 |
| 7939380 | Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure | Shutesh Krishnan, Jatinder Kumar | 2011-05-10 |