Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424522 | Leadless semiconductor packages, leadframes therefor, and methods of making | Soon Wei WANG, Chee Hiong CHEW | 2025-09-23 |
| 11145581 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | James P. Letterman, Jr. | 2021-10-12 |
| 11049843 | Semiconductor packages | Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis | 2021-06-29 |
| 11037903 | Plasma etch singulated semiconductor packages and related methods | — | 2021-06-15 |
| 10770333 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-09-08 |
| 10770332 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-09-08 |
| 10756006 | Leadless semiconductor packages, leadframes therefor, and methods of making | Soon Wei WANG, Chee Hiong CHEW | 2020-08-25 |
| 10707111 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2020-07-07 |
| 10529632 | Damaging components with defective electrical couplings | James P. Letterman, Jr. | 2020-01-07 |
| 10399756 | Carrier tape with standoff units | — | 2019-09-03 |
| 10304798 | Semiconductor packages with leadframes and related methods | Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis | 2019-05-28 |
| 10269609 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2019-04-23 |
| 10199311 | Leadless semiconductor packages, leadframes therefor, and methods of making | Soon Wei WANG, Chee Hiong CHEW | 2019-02-05 |
| 10163766 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | James P. Letterman, Jr. | 2018-12-25 |
| 10103072 | Damaging components with defective electrical couplings | James P. Letterman, Jr. | 2018-10-16 |
| 10093468 | Carrier tape with standoff units | — | 2018-10-09 |
| 9899349 | Semiconductor packages and related methods | Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis | 2018-02-20 |
| 9892952 | Wafer level flat no-lead semiconductor packages and methods of manufacture | James P. Letterman, Jr. | 2018-02-13 |
| 9659876 | Wafer-scale marking systems and related methods | — | 2017-05-23 |
| 9559007 | Plasma etch singulated semiconductor packages and related methods | — | 2017-01-31 |
| 8987054 | Semiconductor devices and methods of making the same | — | 2015-03-24 |
| D510728 | Semiconductor device package | Phillip Celaya, Michael J. Seddon | 2005-10-18 |
| D504874 | Semiconductor device package | Phillip Celaya, Michael J. Seddon | 2005-05-10 |
| 6852574 | Method of forming a leadframe for a semiconductor package | Guan Keng Quah | 2005-02-08 |
| 5585281 | Process and apparatus for forming and testing semiconductor package leads | Theodore R. Golubic, Maureen Sugai | 1996-12-17 |