Darrell D. Truhitte — 25 Patents at onsemi

Darrell D. Truhitte has been granted 25 US patents while listed as an inventor at onsemi. The first was granted in 1996 and the most recent in September 2025. Darrell D. Truhitte ranks #158,593 of 4,157,543 US inventors in our database (top 3.8%). Patent records list Darrell D. Truhitte in Phoenix, AZ, US.

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Showing 1–25 of 25 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12424522	Leadless semiconductor packages, leadframes therefor, and methods of making	Soon Wei WANG, Chee Hiong CHEW	2025-09-23
11145581	Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks	James P. Letterman, Jr.	2021-10-12	$28,470,000
11049843	Semiconductor packages	Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis	2021-06-29	$26,252,000
11037903	Plasma etch singulated semiconductor packages and related methods	—	2021-06-15	$16,180,000
10770333	Wafer level flat no-lead semiconductor packages and methods of manufacture	James P. Letterman, Jr.	2020-09-08	$14,116,000
10770332	Wafer level flat no-lead semiconductor packages and methods of manufacture	James P. Letterman, Jr.	2020-09-08	$14,116,000
10756006	Leadless semiconductor packages, leadframes therefor, and methods of making	Soon Wei WANG, Chee Hiong CHEW	2020-08-25	$10,913,000
10707111	Wafer level flat no-lead semiconductor packages and methods of manufacture	James P. Letterman, Jr.	2020-07-07	$8,550,000
10529632	Damaging components with defective electrical couplings	James P. Letterman, Jr.	2020-01-07	$11,968,000
10399756	Carrier tape with standoff units	—	2019-09-03	$9,477,000
10304798	Semiconductor packages with leadframes and related methods	Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis	2019-05-28	$10,691,000
10269609	Wafer level flat no-lead semiconductor packages and methods of manufacture	James P. Letterman, Jr.	2019-04-23	$9,266,000
10199311	Leadless semiconductor packages, leadframes therefor, and methods of making	Soon Wei WANG, Chee Hiong CHEW	2019-02-05	$11,062,000
10163766	Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks	James P. Letterman, Jr.	2018-12-25
10103072	Damaging components with defective electrical couplings	James P. Letterman, Jr.	2018-10-16	$6,863,000
10093468	Carrier tape with standoff units	—	2018-10-09	$5,139,000
9899349	Semiconductor packages and related methods	Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis	2018-02-20	$10,879,000
9892952	Wafer level flat no-lead semiconductor packages and methods of manufacture	James P. Letterman, Jr.	2018-02-13	$7,882,000
9659876	Wafer-scale marking systems and related methods	—	2017-05-23	$14,248,000
9559007	Plasma etch singulated semiconductor packages and related methods	—	2017-01-31
8987054	Semiconductor devices and methods of making the same	—	2015-03-24	$4,129,000
D510728	Semiconductor device package	Phillip Celaya, Michael J. Seddon	2005-10-18
D504874	Semiconductor device package	Phillip Celaya, Michael J. Seddon	2005-05-10
6852574	Method of forming a leadframe for a semiconductor package	Guan Keng Quah	2005-02-08	$8,180,000
5585281	Process and apparatus for forming and testing semiconductor package leads	Theodore R. Golubic, Maureen Sugai	1996-12-17	$19,693,000

Darrell D. Truhitte — 25 Patents

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