Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5990554 | Semiconductor package having isolated heatsink bonding pads | Timothy L. Olson | 1999-11-23 |
| 5585281 | Process and apparatus for forming and testing semiconductor package leads | Darrell D. Truhitte, Maureen Sugai | 1996-12-17 |
| 5473192 | Unitary silicon die module | Udey Chaudhry | 1995-12-05 |
| 4994897 | Multi-level semiconductor package | Frank Polka, Brian A. Webb | 1991-02-19 |
| 4832784 | Positive stop, pick up tool | — | 1989-05-23 |
| 4801992 | Three dimensional interconnected integrated circuit | — | 1989-01-31 |