Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks

Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks

US Patent 11145581 · Granted Oct 12, 2021

Estimated economic value: $28,470,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leadless semiconductor packages, leadframes therefor, and methods of making2025
Semiconductor packages2021
Semiconductor packages2021
Plasma etch singulated semiconductor packages and related methods2021
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Leadless semiconductor packages, leadframes therefor, and methods of making2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Damaging components with defective electrical couplings2020