Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level flat no-lead semiconductor packages and methods of manufacture

Wafer level flat no-lead semiconductor packages and methods of manufacture

US Patent 10770332 · Granted Sep 8, 2020

Estimated economic value: $14,116,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leadless semiconductor packages, leadframes therefor, and methods of making2025
Methods of forming leadless semiconductor packages with plated leadframes and we2021
Methods of forming leadless semiconductor packages with plated leadframes and we2021
Semiconductor packages2021
Semiconductor packages2021
Plasma etch singulated semiconductor packages and related methods2021
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Leadless semiconductor packages, leadframes therefor, and methods of making2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Damaging components with defective electrical couplings2020