Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages with leadframes and related methods

Semiconductor packages with leadframes and related methods

US Patent 10304798 · Granted May 28, 2019

Estimated economic value: $10,691,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leadless semiconductor packages, leadframes therefor, and methods of making2025
Semiconductor devices and methods of making the same2023
Methods of forming leadless semiconductor packages with plated leadframes and we2021
Methods of forming leadless semiconductor packages with plated leadframes and we2021
Semiconductor packages2021
Semiconductor packages2021
Semiconductor packages2021
Semiconductor packages2021
Plasma etch singulated semiconductor packages and related methods2021
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020
Wafer level flat no-lead semiconductor packages and methods of manufacture2020