Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557530 | Semiconductor devices and methods of making the same | Swee Har KHOR, Tian Hing Lim, Hui Min LER, Chee Hiong CHEW | 2023-01-17 |
| 11049843 | Semiconductor packages | James P. Letterman, Jr., Robert L. Marquis, Darrell D. Truhitte | 2021-06-29 |
| 10727170 | Semiconductor devices and methods of making the same | Swee Har KHOR, Tian Hing Lim, Hui Min LER, Chee Hiong CHEW | 2020-07-28 |
| 10304798 | Semiconductor packages with leadframes and related methods | James P. Letterman, Jr., Robert L. Marquis, Darrell D. Truhitte | 2019-05-28 |
| 9899349 | Semiconductor packages and related methods | James P. Letterman, Jr., Robert L. Marquis, Darrell D. Truhitte | 2018-02-20 |
| 9620443 | Semiconductor component and method of manufacture | Balaji Padmanabhan, Prasad Venkatraman, Ali Salih, Chun-Li Liu | 2017-04-11 |
| 9379048 | Dual-flag stacked die package | Frank Tim Jones | 2016-06-28 |
| 8581416 | Method of forming a semiconductor device and leadframe therefor | Harold L. Massie, David F. Moeller, Mark Randol | 2013-11-12 |
| 8461670 | Semiconductor component and method of manufacture | Yeu Wen Lee, Weng Onn Low, Virgilio Abalos, Jr., Jamieson Wardall | 2013-06-11 |
| 8324026 | Method for manufacturing a semiconductor component | James P. Letterman, Jr., Robert L. Marquis | 2012-12-04 |
| 8253239 | Multi-chip semiconductor connector | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2012-08-28 |
| 8071427 | Method for manufacturing a semiconductor component and structure therefor | James P. Letterman, Jr., Robert L. Marquis | 2011-12-06 |
| 7875964 | Multi-chip semiconductor connector and method | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2011-01-25 |
| 7825505 | Semiconductor package and method therefor | James P. Letterman, Jr. | 2010-11-02 |
| 7638863 | Semiconductor package and method therefor | James P. Letterman, Jr. | 2009-12-29 |
| 7508060 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen Germain, Jay A. Yoder | 2009-03-24 |
| 7498195 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2009-03-03 |
| 7495323 | Semiconductor package structure having multiple heat dissipation paths and method of manufacture | Stephen St. Germain, Roger M. Arbuthnot, Francis J. Carney | 2009-02-24 |
| 7298034 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-11-20 |
| 7202106 | Multi-chip semiconductor connector and method | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7202105 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7180170 | Lead-free integrated circuit package structure | James S. Donley, Stephen St. Germain | 2007-02-20 |
| D510728 | Semiconductor device package | Darrell D. Truhitte, Michael J. Seddon | 2005-10-18 |
| D504874 | Semiconductor device package | Darrell D. Truhitte, Michael J. Seddon | 2005-05-10 |
| 6889429 | Method of making a lead-free integrated circuit package | James S. Donley, Stephen St. Germain | 2005-05-10 |