Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8319323 | Electronic package having down-set leads and method | James P. Letterman, Jr., Jay A. Yoder, William F. Burghout | 2012-11-27 |
| 8253239 | Multi-chip semiconductor connector | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2012-08-28 |
| 7901990 | Method of forming a molded array package device having an exposed tab and structure | James P. Letterman, Jr., Kent L. Kime | 2011-03-08 |
| 7875964 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2011-01-25 |
| 7820528 | Method of forming a leaded molded array package | William F. Burghout, Francis J. Carney, James P. Letterman, Jr., Jay A. Yoder | 2010-10-26 |
| 7656048 | Encapsulated chip scale package having flip-chip on lead frame structure | James P. Letterman, Jr., Denise Thienpont | 2010-02-02 |
| 7602054 | Method of forming a molded array package device having an exposed tab and structure | James P. Letterman, Jr., Kent L. Kime | 2009-10-13 |
| 7598123 | Semiconductor component and method of manufacture | Jay A. Yoder, James P. Letterman, Jr. | 2009-10-06 |
| 7588999 | Method of forming a leaded molded array package | William F. Burghout, Francis J. Carney, James P. Letterman, Jr., Jay A. Yoder | 2009-09-15 |
| 7508060 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen Germain, Jay A. Yoder | 2009-03-24 |
| 7498195 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2009-03-03 |
| 7439100 | Encapsulated chip scale package having flip-chip on lead frame structure and method | James P. Letterman, Jr., Denise Thienpont | 2008-10-21 |
| 7298034 | Multi-chip semiconductor connector assemblies | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-11-20 |
| 7202106 | Multi-chip semiconductor connector and method | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7202105 | Multi-chip semiconductor connector assembly method | Francis J. Carney, Phillip Celaya, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7109064 | Method of forming a semiconductor package and leadframe therefor | James H. Knapp, James P. Letterman, Jr. | 2006-09-19 |
| 6768186 | Semiconductor device and laminated leadframe package | James P. Letterman, Jr., Jay A. Yoder | 2004-07-27 |
| 6164523 | Electronic component and method of manufacture | James P. Letterman, Jr., Michael J. Seddon | 2000-12-26 |
| 6081031 | Semiconductor package consisting of multiple conductive layers | James P. Letterman, Jr., Albert J. Laninga, James H. Knapp, William F. Burghout | 2000-06-27 |