Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7656048 | Encapsulated chip scale package having flip-chip on lead frame structure | Joseph K. Fauty, James P. Letterman, Jr. | 2010-02-02 |
| 7439100 | Encapsulated chip scale package having flip-chip on lead frame structure and method | Joseph K. Fauty, James P. Letterman, Jr. | 2008-10-21 |