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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
KK

Kent L. Kime — 11 Patents

ONonsemi: 5 patents #311 of 1,901Top 20%
Honeywell: 5 patents #3,208 of 16,504Top 20%
Motorola: 1 patents #12,485 of 14,142Top 90%
Phoenix, AZ: #568 of 6,660 inventorsTop 9%
Arizona: #3,355 of 32,909 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Kent L. Kime has been granted 11 US patents while listed as an inventor at onsemi. The first was granted in 2000 and the most recent in November 2021. Kent L. Kime ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Kent L. Kime in Phoenix, AZ, US.

Patents per Year

Patents granted per year, 2000 to 2021Bar chart with a peak of 3 patents in 2021.peak 32000: 1 patents20002004: 1 patents20042006: 1 patents20062009: 1 patents20092010: 1 patents20102011: 1 patents20112019: 1 patents20192020: 1 patents20202021: 3 patents2021

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11181006 Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement Jason Smoke, Blake Petersen, Luke Zurmehly 2021-11-23 $33,053,000
10907487 Turbine shroud assemblies for gas turbine engines Luke Zurmehly, Jason Smoke, Blake Petersen 2021-02-02 $38,398,000
10900378 Turbine tip shroud assembly with plural shroud segments having internal cooling passages Jason Smoke, Blake Petersen, Luke Zurmehly 2021-01-26 $60,939,000
10677084 Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement Jason Smoke, Blake Petersen, Luke Zurmehly 2020-06-09 $27,192,000
10359051 Impeller shroud supports having mid-impeller bleed flow passages and gas turbine engines including the same Raymond Gage, Bruce David Reynolds, Jeffrey David Harrison, Michael T. Barton, Mahmoud Mansour 2019-07-23 $33,453,000
7901990 Method of forming a molded array package device having an exposed tab and structure James P. Letterman, Jr., Joseph K. Fauty 2011-03-08 $5,413,000
7755179 Semiconductor package structure having enhanced thermal dissipation characteristics Francis J. Carney, Michael J. Seddon, Dluong Ngan Leong, Yeu Wen Lee 2010-07-13 $10,846,000
7602054 Method of forming a molded array package device having an exposed tab and structure James P. Letterman, Jr., Joseph K. Fauty 2009-10-13 $12,717,000
6984876 Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof Jeffrey Pearse 2006-01-10 $13,245,000
D489338 Packaged semiconductor device Michael J. Seddon, Francis J. Carney 2004-05-04
6147410 Electronic component and method of manufacture Alexander J. Elliott, Timothy E. Meko, Gary R. Lorenzen, Prosanto K. Mukerji, Keith W. Bailey +3 more 2000-11-14 $23,892,000