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Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement |
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Turbine shroud assemblies for gas turbine engines |
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Turbine tip shroud assembly with plural shroud segments having internal cooling passages |
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Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement |
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Method of forming a molded array package device having an exposed tab and structure |
James P. Letterman, Jr., Joseph K. Fauty |
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Semiconductor package structure having enhanced thermal dissipation characteristics |
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Method of forming a molded array package device having an exposed tab and structure |
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2009-10-13 |
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Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof |
Jeffrey Pearse |
2006-01-10 |
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Alexander J. Elliott, Timothy E. Meko, Gary R. Lorenzen, Prosanto K. Mukerji, Keith W. Bailey +3 more |
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