Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11181006 | Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement | Jason Smoke, Blake Petersen, Luke Zurmehly | 2021-11-23 |
| 10907487 | Turbine shroud assemblies for gas turbine engines | Luke Zurmehly, Jason Smoke, Blake Petersen | 2021-02-02 |
| 10900378 | Turbine tip shroud assembly with plural shroud segments having internal cooling passages | Jason Smoke, Blake Petersen, Luke Zurmehly | 2021-01-26 |
| 10677084 | Turbine tip shroud assembly with plural shroud segments having inter-segment seal arrangement | Jason Smoke, Blake Petersen, Luke Zurmehly | 2020-06-09 |
| 10359051 | Impeller shroud supports having mid-impeller bleed flow passages and gas turbine engines including the same | Raymond Gage, Bruce David Reynolds, Jeffrey David Harrison, Michael T. Barton, Mahmoud Mansour | 2019-07-23 |
| 7901990 | Method of forming a molded array package device having an exposed tab and structure | James P. Letterman, Jr., Joseph K. Fauty | 2011-03-08 |
| 7755179 | Semiconductor package structure having enhanced thermal dissipation characteristics | Francis J. Carney, Michael J. Seddon, Dluong Ngan Leong, Yeu Wen Lee | 2010-07-13 |
| 7602054 | Method of forming a molded array package device having an exposed tab and structure | James P. Letterman, Jr., Joseph K. Fauty | 2009-10-13 |
| 6984876 | Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof | Jeffrey Pearse | 2006-01-10 |
| D489338 | Packaged semiconductor device | Michael J. Seddon, Francis J. Carney | 2004-05-04 |
| 6147410 | Electronic component and method of manufacture | Alexander J. Elliott, Timothy E. Meko, Gary R. Lorenzen, Prosanto K. Mukerji, Keith W. Bailey +3 more | 2000-11-14 |