Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799627 | Semiconductor package structure and method | Bishnu Prasanna Gogoi, Robert B. Davies, Phuong Trong Le | 2017-10-24 |
| 8310042 | Heatsink moldlocks | L. M. Mahalingam, William Strom | 2012-11-13 |
| 7445967 | Method of packaging a semiconductor die and package thereof | David F. Abdo, Lakshminarayan Viswanathan | 2008-11-04 |
| 7092890 | Method for manufacturing thin GaAs die with copper-back metal structures | Jeffrey Dale Crowder, Monte G. Miller | 2006-08-15 |
| 7091602 | Miniature moldlocks for heatsink or flag for an overmolded plastic package | L. M. Mahalingam, William Strom | 2006-08-15 |
| 6996897 | Method of making a mount for electronic devices | Frank J. Mosna, Jr., William Strom | 2006-02-14 |
| 6982483 | High impedance radio frequency power plastic package | Robert J. McLaughlin, Mall Mahalingam, Scott D. Marshall, Pierre Marie Jean Piel | 2006-01-03 |
| 6870243 | Thin GaAs die with copper back-metal structure | Jeffrey Dale Crowder, Monte G. Miller | 2005-03-22 |
| 6147410 | Electronic component and method of manufacture | Timothy E. Meko, Gary R. Lorenzen, Kent L. Kime, Prosanto K. Mukerji, Keith W. Bailey +3 more | 2000-11-14 |
| 5786745 | Electronic package and method | Lonne L. Mays | 1998-07-28 |
| 5614131 | Method of making an optoelectronic device | Prosanto K. Mukerji, Shanmugam Suppiah | 1997-03-25 |
| 5175007 | Mold assembly with separate encapsulating cavities | — | 1992-12-29 |
| 5074139 | Roll forming of semiconductor component leadframes | — | 1991-12-24 |
| 5075255 | Method of removing contaminants from a plated article with a clean burning hydrogen flame | — | 1991-12-24 |