Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, Lakshminarayan Viswanathan, Colby Greg Rampley, Fernando A. Santos | 2022-09-06 |
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, Lakshminarayan Viswanathan, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10637400 | RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof | Jeffrey K. Jones, Basim Noori | 2020-04-28 |
| 10630246 | Methods of manufacturing encapsulated semiconductor device package with heatsink opening | Jeffrey K. Jones | 2020-04-21 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2019-04-23 |
| 10109594 | Semiconductor device with an isolation structure coupled to a cover of the semiconductor device | Lakshminarayan Viswanathan, Michael E. Watts | 2018-10-23 |
| 10075132 | RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof | Jeffrey K. Jones, Basim Noori | 2018-09-11 |
| 9922894 | Air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, Jaynal A. Molla, Mali Mahalingam, Carl E. D'Acosta | 2018-03-20 |
| 9893027 | Pre-plated substrate for die attachment | Sivanesan A/L Sathiapalan | 2018-02-13 |
| 9787254 | Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof | Jeffrey K. Jones | 2017-10-10 |
| 9425161 | Semiconductor device with mechanical lock features between a semiconductor die and a substrate | Lakshminarayan Viswanathan, L. M. Mahalingam, Jaynal A. Molla | 2016-08-23 |
| 9349693 | Semiconductor device with an isolation structure coupled to a cover of the semiconductor device | Viswanathan Lakshminarayan, Michael E. Watts | 2016-05-24 |
| 9111984 | Devices and methods of operation for separating semiconductor die from adhesive tape | Audel A. Sanchez, Michael L. Eleff | 2015-08-18 |
| 9099567 | Packaged semiconductor devices and methods of their fabrication | Lakshminarayan Viswanathan, L. M. Mahalingam, Jaynal A. Molla | 2015-08-04 |
| 8535982 | Providing an automatic optical inspection feature for solder joints on semiconductor packages | Pamela A. O'Brien | 2013-09-17 |
| 8318545 | Method of making a mounted gallium nitride device | Monte G. Miller, Lakshminarayan Viswanathan | 2012-11-27 |
| 7445967 | Method of packaging a semiconductor die and package thereof | Alexander J. Elliott, Lakshminarayan Viswanathan | 2008-11-04 |
| 6072238 | Semiconductor component | Lakshminarayan Viswanathan, Gerald R. Miller | 2000-06-06 |