GT

Geoffrey Tucker

NU Nxp Usa: 11 patents #128 of 2,066Top 7%
CP Cmb Foodcan Plc: 1 patents #18 of 67Top 30%
FS Freeescale Semiconductor: 1 patents #2,021 of 3,767Top 55%
ML Metal Box Public Limited: 1 patents #15 of 56Top 30%
📍 Tempe, AZ: #197 of 2,648 inventorsTop 8%
🗺 Arizona: #2,515 of 32,909 inventorsTop 8%
Overall (All Time): #337,206 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
11990872 Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof Lakshminarayan Viswanathan, Jeffrey K. Jones, Elie A. Maalouf 2024-05-21
11888238 Linear impedance compensation system with microstrip and slotline coupling and controllable capacitance Oleksandr Nikolayenkov, Martin Beuttner 2024-01-30
11322844 Impedance compensation system with microstrip and slotline coupling and controllable capacitance Oleksandr Nikolayenkov, Martin Beuttner 2022-05-03
10861764 Microelectronic components having integrated heat dissipation posts and systems including the same Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Carl E. D'Acosta +3 more 2020-12-08
10826437 Amplifier power combiner with slotline impedance transformer Oleksandr Nikolayenkov 2020-11-03
10785862 Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof Lakshminarayan Viswanathan, Elie A. Maalouf 2020-09-22
10485091 Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof Jaynal A. Molla, Lakshminarayan Viswanathan, Elie A. Maalouf 2019-11-19
10431449 Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof Jaynal A. Molla, Lakshminarayan Viswanathan 2019-10-01
10269678 Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Carl E. D'Acosta +3 more 2019-04-23
10141182 Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof Jaynal A. Molla, Lakshminarayan Viswanathan 2018-11-27
10104759 Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof Lakshminarayan Viswanathan, Elie A. Maalouf 2018-10-16
9209754 Amplifier with adjustable load Ramanujam Srinidhi Embar, Joseph Staudinger 2015-12-08
5054265 Method of aseptic packaging and closing containers John A. Perigo 1991-10-08
D292883 Container for food products Christopher J. Griffin, John A. Perigo 1987-11-24