Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10806021 | Packaged microelectronic component mounting using sinter attachment | Lakshminarayan Viswanathan, Lu Li, Paul R. Hart | 2020-10-13 |
| 10630243 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2020-04-21 |
| 10476442 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2019-11-12 |
| 10440813 | Microelectronic modules including thermal extension levels and methods for the fabrication thereof | Lu Li, Elie A. Maalouf, Lakshminarayan Viswanathan | 2019-10-08 |
| 10405417 | Packaged microelectronic component mounting using sinter attachment | Lakshminarayan Viswanathan, Lu Li, Paul R. Hart | 2019-09-03 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2019-04-23 |
| 10211177 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott M. Hayes, Scott D. Marshall | 2019-02-19 |
| 10110170 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2018-10-23 |
| 9800208 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez, Lakshminarayan Viswanathan +1 more | 2017-10-24 |
| 9673162 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott M. Hayes, Scott D. Marshall | 2017-06-06 |
| 9607953 | Semiconductor package with isolation wall | Lu Li, Hamdan Ismail, Samy R. N. Naidu | 2017-03-28 |
| 9538659 | Solder wettable flanges and devices and systems incorporating solder wettable flanges | Lakshminarayan Viswanathan, Jaynal A. Molla | 2017-01-03 |
| 9484222 | Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations | Hussain H. Ladhani, Lu Li, Lakshminarayan Viswanathan, Michael E. Watts | 2016-11-01 |
| 9450547 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Fernando A. Santos | 2016-09-20 |
| 9300254 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez, Lakshminarayan Viswanathan +1 more | 2016-03-29 |
| 7701074 | Semiconductor device with a buffer region with tightly-packed filler particles | Brian Condie, L. M. Mahalingam | 2010-04-20 |
| 7435625 | Semiconductor device with reduced package cross-talk and loss | Brian Condie, Mali Mahalingam | 2008-10-14 |
| 7432133 | Plastic packaged device with die interface layer | Brian Condie | 2008-10-07 |
| 7332414 | Chemical die singulation technique | Brian Condie, David J. Dougherty | 2008-02-19 |
| 5918112 | Semiconductor component and method of fabrication | John W. Hart | 1999-06-29 |
| 5888412 | Method for making a sculptured diaphragm | Kathirgamasundaram Sooriakumar, Andrew C. McNeil, Kenneth G. Goldman | 1999-03-30 |
| 5581226 | High pressure sensor structure and method | — | 1996-12-03 |
| 5528069 | Sensing transducer using a Schottky junction and having an increased output signal voltage | Dragan Mladenovic | 1996-06-18 |