Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8461670 | Semiconductor component and method of manufacture | Phillip Celaya, Weng Onn Low, Virgilio Abalos, Jr., Jamieson Wardall | 2013-06-11 |
| 7755179 | Semiconductor package structure having enhanced thermal dissipation characteristics | Francis J. Carney, Michael J. Seddon, Kent L. Kime, Dluong Ngan Leong | 2010-07-13 |
| 7247931 | Semiconductor package and leadframe therefor having angled corners | Chuan Kiak Ng, Ein Sun Ng | 2007-07-24 |
| 7144538 | Method for making a direct chip attach device and structure | Chuan Kiak Ng, Guan Keng Quah | 2006-12-05 |
| 7105378 | Method of forming a leadframe for a semiconductor package | Chuan Kiak Ng, Ein Sun Ng | 2006-09-12 |