Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7755179 | Semiconductor package structure having enhanced thermal dissipation characteristics | Francis J. Carney, Michael J. Seddon, Kent L. Kime, Yeu Wen Lee | 2010-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7755179 | Semiconductor package structure having enhanced thermal dissipation characteristics | Francis J. Carney, Michael J. Seddon, Kent L. Kime, Yeu Wen Lee | 2010-07-13 |