Issued Patents All Time
Showing 25 most recent of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2025-09-30 |
| 12376333 | Configurable low ohmic power circuits | Santosh Menon, Radim SPETIK, Bruce Greenwood, Robert Davis, Ladislav Seliga | 2025-07-29 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12354917 | Singulation systems and related methods | — | 2025-07-08 |
| 12341069 | Backside metal patterning die singulation system and related methods | — | 2025-06-24 |
| 12322632 | Substrate alignment systems and related methods | Takashi Noma | 2025-06-03 |
| 12315765 | Backside metal patterning die singulation systems and related methods | — | 2025-05-27 |
| 12272572 | Non-planar semiconductor packaging systems and related methods | Francis J. Carney | 2025-04-08 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Jerome Teysseyre, Oseob Jeon, Keunhyuk LEE | 2025-04-01 |
| 12255167 | Semiconductor packages with an intermetallic layer | Francis J. Carney | 2025-03-18 |
| 12230551 | Immersion direct cooling modules | Oseob Jeon, Youngsun KO, Seungwon IM, Jerome Teysseyre | 2025-02-18 |
| 12230559 | Semiconductor device and method of forming micro interconnect structures | Francis J. Carney, Jefferson W. Hall | 2025-02-18 |
| 12230543 | Die cleaning systems and related methods | — | 2025-02-18 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2025-02-18 |
| 12211784 | SOI substrate and related methods | Mark Griswold | 2025-01-28 |
| 12154783 | Semiconductor wafer and method of wafer thinning | — | 2024-11-26 |
| 12154877 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2024-11-26 |
| 12148665 | Jet ablation die singulation systems and related methods | — | 2024-11-19 |
| 12132008 | Multidie supports and related methods | Francis J. Carney | 2024-10-29 |
| 12132005 | Supports for thinned semiconductor substrates and related methods | Francis J. Carney | 2024-10-29 |
| 12119294 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2024-10-15 |
| 12094750 | Tape heating methods | — | 2024-09-17 |
| 12040295 | Semiconductor device with backmetal and related methods | Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN | 2024-07-16 |
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-07-16 |