Issued Patents All Time
Showing 26–50 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12020972 | Curved semiconductor die systems and related methods | Francis J. Carney | 2024-06-25 |
| 11987874 | Backside metal formation methods and systems | — | 2024-05-21 |
| 11972980 | Singulation systems and related methods | — | 2024-04-30 |
| 11948880 | SOI substrate and related methods | Mark Griswold | 2024-04-02 |
| 11942366 | Backside metal patterning die singulation systems and related methods | — | 2024-03-26 |
| 11929285 | Backside metal patterning die singulation system and related methods | — | 2024-03-12 |
| 11908699 | Semiconductor packages with die including cavities | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-20 |
| 11901184 | Backmetal removal methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-13 |
| 11894245 | Non-planar semiconductor packaging systems and related methods | Francis J. Carney | 2024-02-06 |
| 11854995 | Supports for thinned semiconductor substrates and related methods | Francis J. Carney | 2023-12-26 |
| 11854889 | Die cleaning systems and related methods | — | 2023-12-26 |
| 11830771 | Semiconductor substrate production systems and related methods | — | 2023-11-28 |
| 11830756 | Temporary die support structures and related methods | Francis J. Carney | 2023-11-28 |
| 11823965 | Substrate processing carrier | — | 2023-11-21 |
| 11823953 | Semiconductor substrate processing methods | — | 2023-11-21 |
| 11756830 | Jet ablation die singulation systems and related methods | — | 2023-09-12 |
| 11710691 | Semiconductor device and method of forming micro interconnect structures | Francis J. Carney, Jefferson W. Hall | 2023-07-25 |
| 11694937 | Semiconductor wafer and method of probe testing | — | 2023-07-04 |
| 11676863 | Structures for aligning a semiconductor wafer for singulation | Takashi Noma | 2023-06-13 |
| 11652010 | Semiconductor substrate crack mitigation systems and related methods | — | 2023-05-16 |
| 11651998 | Plasma die singulation systems and related methods | — | 2023-05-16 |
| 11616008 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2023-03-28 |
| 11605561 | Backside metal removal die singulation systems and related methods | — | 2023-03-14 |
| 11581223 | Backside metal patterning die singulation system and related methods | — | 2023-02-14 |
| 11508579 | Backside metal photolithographic patterning die singulation systems and related methods | Takashi Noma | 2022-11-22 |