Issued Patents All Time
Showing 51–75 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495529 | SOI substrate and related methods | Mark Griswold | 2022-11-08 |
| 11495493 | Backside metal patterning die singulation systems and related methods | — | 2022-11-08 |
| 11437291 | Multichip module supports and related methods | Francis J. Carney | 2022-09-06 |
| 11430746 | Multidie supports for reducing die warpage | Francis J. Carney | 2022-08-30 |
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Francis J. Carney, Yusheng LIN, Takashi Noma, Eiji KUROSE | 2022-07-19 |
| 11387145 | Jet ablation die singulation systems and related methods | — | 2022-07-12 |
| 11387130 | Substrate alignment systems and related methods | Takashi Noma | 2022-07-12 |
| 11373859 | Semiconductor substrate singulation systems and related methods | Thomas Neyer, Fredrik Allerstam | 2022-06-28 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2022-06-21 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Francis J. Carney, Eiji KUROSE, Chee Hiong CHEW, Soon Wei WANG | 2022-06-14 |
| 11348796 | Backmetal removal methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-24 |
| 11289381 | Methods of aligning a semiconductor wafer for singulation | Takashi Noma | 2022-03-29 |
| 11289380 | Backside metal patterning die singulation systems and related methods | — | 2022-03-29 |
| 11289358 | Wafer thinning systems and related methods | — | 2022-03-29 |
| 11257724 | Semiconductor wafer and method of probe testing | — | 2022-02-22 |
| 11254565 | Absolute and differential pressure sensors and related methods | — | 2022-02-22 |
| 11222840 | Silicon-on-insulator (SOI) substrate and related methods | Mark Griswold | 2022-01-11 |
| 11211359 | Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates | Francis J. Carney | 2021-12-28 |
| 11164835 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2021-11-02 |
| 11152211 | Semiconductor wafer thinning systems and related methods | Thomas Neyer | 2021-10-19 |
| 11127634 | Backside metal removal die singulation systems and related methods | — | 2021-09-21 |
| 11121035 | Semiconductor substrate processing methods | — | 2021-09-14 |
| 11114329 | Methods for loading or unloading substrate with evaporator planet | Heng Chen Lee | 2021-09-07 |