Issued Patents All Time
Showing 101–125 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770351 | Semiconductor substrate production systems and related methods | — | 2020-09-08 |
| 10755956 | Backside wafer alignment methods | Takashi Noma | 2020-08-25 |
| 10741484 | Stacked semiconductor device structure and method | Francis J. Carney | 2020-08-11 |
| 10741487 | SOI substrate and related methods | Mark Griswold | 2020-08-11 |
| 10685863 | Wafer thinning systems and related methods | — | 2020-06-16 |
| 10685891 | Semicoductor wafer and method of backside probe testing through opening in film frame | Heng Chen Lee | 2020-06-16 |
| 10679898 | Semiconductor substrate die sawing singulation systems and methods | — | 2020-06-09 |
| 10665458 | Semiconductor wafer thinning systems and related methods | Thomas Neyer | 2020-05-26 |
| 10615127 | Thinned semiconductor wafer | — | 2020-04-07 |
| 10607889 | Jet ablation die singulation systems and related methods | — | 2020-03-31 |
| 10593602 | Semiconductor substrate crack mitigation systems and related methods | — | 2020-03-17 |
| 10589989 | Absolute and differential pressure sensors and related methods | — | 2020-03-17 |
| 10573803 | Current sensor packages with through hole in semiconductor | Jefferson W. Hall, Yenting Wen | 2020-02-25 |
| 10468304 | Semiconductor substrate production systems and related methods | — | 2019-11-05 |
| 10461000 | Semiconductor wafer and method of probe testing | Heng Chen Lee | 2019-10-29 |
| 10453784 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Francis J. Carney | 2019-10-22 |
| 10446480 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2019-10-15 |
| 10403544 | Semiconductor die singulation methods | — | 2019-09-03 |
| 10388526 | Semiconductor wafer thinning systems and related methods | Thomas Neyer | 2019-08-20 |
| 10199316 | Semiconductor device and method of aligning semiconductor wafers for bonding | Francis J. Carney | 2019-02-05 |
| 10170381 | Semiconductor wafer and method of backside probe testing through opening in film frame | Heng Chen Lee | 2019-01-01 |
| 10163772 | Stacked semiconductor device structure and method | Francis J. Carney | 2018-12-25 |
| 10115716 | Die bonding to a board | Francis J. Carney | 2018-10-30 |
| 10115662 | Semiconductor device and method of forming a curved image sensor | Francis J. Carney, Eric Woolsey | 2018-10-30 |
| 10109475 | Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark | — | 2018-10-23 |