MS

Michael J. Seddon

ON onsemi: 169 patents #2 of 1,901Top 1%
📍 Gilbert, AZ: #2 of 1,739 inventorsTop 1%
🗺 Arizona: #50 of 32,909 inventorsTop 1%
Overall (All Time): #4,801 of 4,157,543Top 1%
169
Patents All Time

Issued Patents All Time

Showing 151–169 of 169 patents

Patent #TitleCo-InventorsDate
8664089 Semiconductor die singulation method William F. Burghout, Dennis Lee Conner, Jay A. Yoder 2014-03-04
8445375 Method for manufacturing a semiconductor component Francis J. Carney 2013-05-21
8384231 Method of forming a semiconductor die Gordon M. Grivna 2013-02-26
8292690 Thinned semiconductor wafer and method of thinning a semiconductor wafer 2012-10-23
8084335 Method of thinning a semiconductor wafer using a film frame Francis J. Carney 2011-12-27
8012857 Semiconductor die singulation method Gordon M. Grivna 2011-09-06
7989319 Semiconductor die singulation method Gordon M. Grivna 2011-08-02
7944044 Semiconductor package structure having enhanced thermal dissipation characteristics Francis J. Carney 2011-05-17
7755179 Semiconductor package structure having enhanced thermal dissipation characteristics Francis J. Carney, Kent L. Kime, Dluong Ngan Leong, Yeu Wen Lee 2010-07-13
7476959 Encapsulated electronic device Stephen St. Germain 2009-01-13
7319266 Encapsulated electronic device structure Stephen St. Germain 2008-01-15
7265454 Semiconductor device and method of producing high contrast identification mark Francis J. Carney 2007-09-04
7135356 Semiconductor device and method of producing a high contrast identification mark Francis J. Carney 2006-11-14
D510728 Semiconductor device package Phillip Celaya, Darrell D. Truhitte 2005-10-18
D504874 Semiconductor device package Phillip Celaya, Darrell D. Truhitte 2005-05-10
D489338 Packaged semiconductor device Francis J. Carney, Kent L. Kime 2004-05-04
6376266 Semiconductor package and method for forming same James P. Letterman, Jr., Kenneth Teik Kheong Low, Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim +4 more 2002-04-23
6300679 Flexible substrate for packaging a semiconductor component Prosanto K. Mukerji, Ronald E. Thomas, George W. Hawkins, Rajesh Srinivasan, Colin B. Bosch +2 more 2001-10-09
6164523 Electronic component and method of manufacture Joseph K. Fauty, James P. Letterman, Jr. 2000-12-26