Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984388 | Semiconductor package structures and methods of manufacture | Stephen St. Germain, Jay A. Yoder, Frank Robert Cervantes, Andrew Celaya | 2024-05-14 |
| 11710686 | Semiconductor package structures and methods of manufacture | Stephen St. Germain, Jay A. Yoder, Frank Robert Cervantes, Andrew Celaya | 2023-07-25 |
| 11217515 | Semiconductor package structures and methods of manufacture | Stephen St. Germain, Jay A. Yoder, Frank Robert Cervantes, Andrew Celaya | 2022-01-04 |
| 10522448 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder | 2019-12-31 |
| 9911684 | Holes and dimples to control solder flow | Stephen St. Germain, Jay A. Yoder | 2018-03-06 |
| 9870986 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder | 2018-01-16 |
| 9847219 | Semiconductor die singulation method | William F. Burghout, Michael J. Seddon, Jay A. Yoder, Gordon M. Grivna | 2017-12-19 |
| 9558968 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder | 2017-01-31 |
| 9484210 | Semiconductor die singulation method | William F. Burghout, Michael J. Seddon, Jay A. Yoder, Gordon M. Grivna | 2016-11-01 |
| 9034733 | Semiconductor die singulation method | William F. Burghout, Michael J. Seddon, Jay A. Yoder, Gordon M. Grivna | 2015-05-19 |
| 8664089 | Semiconductor die singulation method | William F. Burghout, Michael J. Seddon, Jay A. Yoder | 2014-03-04 |