Issued Patents All Time
Showing 25 most recent of 218 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261084 | Fan-out wafer level packaging of semiconductor devices | George Chang, Yusheng LIN, Takashi Noma | 2025-03-25 |
| 12224208 | Method of separating electronic devices having a back layer and apparatus | — | 2025-02-11 |
| 12183785 | Monolithic semiconductor device assemblies | Peter Moens, Yusheng LIN | 2024-12-31 |
| 12132086 | Semiconductor devices with dissimlar materials and methods | — | 2024-10-29 |
| 12100622 | Method of reducing residual contamination in singulated semiconductor die | — | 2024-09-24 |
| 12094967 | Structures and methods for source-down vertical semiconductor device | — | 2024-09-17 |
| 11978671 | Process of forming an electronic device including a polymer support layer | — | 2024-05-07 |
| 11881398 | Semiconductor device and method for supporting ultra-thin semiconductor die | Stephen St. Germain | 2024-01-23 |
| 11810954 | Semiconductor devices with dissimlar materials and methods | — | 2023-11-07 |
| 11784093 | Method of reducing residual contamination in singulated semiconductor die | — | 2023-10-10 |
| 11742381 | Monolithic semiconductor device assemblies | Peter Moens, Yusheng LIN | 2023-08-29 |
| 11670706 | Methods of manufacture for trench-gate insulated-gate bipolar transistors (IGBTs) | Meng-Chia Lee, Ralph N. Wall, Mingjiao Liu, Shamsul Arefin Khan | 2023-06-06 |
| 11563091 | Semiconductor devices with dissimlar materials and methods | — | 2023-01-24 |
| 11488865 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2022-11-01 |
| 11380788 | Structures and methods for source-down vertical semiconductor device | — | 2022-07-05 |
| 11367657 | Process of forming an electronic device including a polymer support layer | — | 2022-06-21 |
| 11355341 | Semiconductor device and method for supporting ultra-thin semiconductor die | Stephen St. Germain | 2022-06-07 |
| 11257916 | Electronic device having multi-thickness gate insulator | Balaji Padmanabhan, Prasad Venkatraman, Zia Hossain, Donald Zaremba, Alexander Young | 2022-02-22 |
| 11088072 | Semiconductor device including a fuse and a transistor coupled to the fuse | Jefferson W. Hall | 2021-08-10 |
| 11056581 | Trench-gate insulated-gate bipolar transistors | Mingjiao Liu, Shamsul Arefin Khan, Meng-Chia Lee, Ralph N. Wall | 2021-07-06 |
| 11043420 | Fan-out wafer level packaging of semiconductor devices | George Chang, Yusheng LIN, Takashi Noma | 2021-06-22 |
| 10950503 | Method of separating electronic devices having a back layer and apparatus | — | 2021-03-16 |
| 10916474 | Method of reducing residual contamination in singulated semiconductor die | — | 2021-02-09 |
| 10854516 | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus | Hou Nion Chan | 2020-12-01 |
| 10833154 | Electronic device including an insulating structure | Steven M. Etter, Hiroyuki Suzuki, Miki Ichiyanagi, Toshihiro Hachiyanagi | 2020-11-10 |