HC

Hou Nion Chan

ON onsemi: 2 patents #740 of 1,901Top 40%
Overall (All Time): #1,924,028 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10854516 Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus Gordon M. Grivna 2020-12-01
10373869 Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus Gordon M. Grivna 2019-08-06