RA

Roger M. Arbuthnot

ON onsemi: 17 patents #83 of 1,901Top 5%
Overall (All Time): #266,471 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12417957 Structure and method related to a power module using a hybrid spacer Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain 2025-09-16
11842942 Structure and method related to a power module using a hybrid spacer Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain 2023-12-12
11282764 Structure and method related to a power module using a hybrid spacer Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain 2022-03-22
11107753 Packaging structure for gallium nitride devices Stephen St. Germain, David P. Billings, Andrew Celaya 2021-08-31
10522448 Single or multi chip module package and related methods Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner 2019-12-31
10490488 Semiconductor devices and methods of making the same Stephen St. Germain 2019-11-26
10325835 Semiconductor devices and methods of making the same Stephen St. Germain 2019-06-18
9870986 Single or multi chip module package and related methods Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner 2018-01-16
9646919 Semiconductor package for a lateral device and related methods Stephen St. Germain, Peter Moens 2017-05-09
9576883 Semiconductor devices and methods of making the same Stephen St. Germain 2017-02-21
9558968 Single or multi chip module package and related methods Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner 2017-01-31
9397028 Semiconductor devices and methods of making the same Stephen St. Germain 2016-07-19
9379193 Semiconductor package for a lateral device and related methods Stephen St. Germain, Peter Moens 2016-06-28
9070721 Semiconductor devices and methods of making the same Stephen St. Germain 2015-06-30
8384206 Semiconductor package Stephen St. Germain, Frank Tim Jones 2013-02-26
7935575 Method of forming a semiconductor package and structure therefor Stephen St. Germain, Frank Tim Jones 2011-05-03
7495323 Semiconductor package structure having multiple heat dissipation paths and method of manufacture Stephen St. Germain, Phillip Celaya, Francis J. Carney 2009-02-24