Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417957 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain | 2025-09-16 |
| 11842942 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain | 2023-12-12 |
| 11282764 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Tzu-Hsuan Cheng, Stephen St. Germain | 2022-03-22 |
| 11107753 | Packaging structure for gallium nitride devices | Stephen St. Germain, David P. Billings, Andrew Celaya | 2021-08-31 |
| 10522448 | Single or multi chip module package and related methods | Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner | 2019-12-31 |
| 10490488 | Semiconductor devices and methods of making the same | Stephen St. Germain | 2019-11-26 |
| 10325835 | Semiconductor devices and methods of making the same | Stephen St. Germain | 2019-06-18 |
| 9870986 | Single or multi chip module package and related methods | Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner | 2018-01-16 |
| 9646919 | Semiconductor package for a lateral device and related methods | Stephen St. Germain, Peter Moens | 2017-05-09 |
| 9576883 | Semiconductor devices and methods of making the same | Stephen St. Germain | 2017-02-21 |
| 9558968 | Single or multi chip module package and related methods | Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner | 2017-01-31 |
| 9397028 | Semiconductor devices and methods of making the same | Stephen St. Germain | 2016-07-19 |
| 9379193 | Semiconductor package for a lateral device and related methods | Stephen St. Germain, Peter Moens | 2016-06-28 |
| 9070721 | Semiconductor devices and methods of making the same | Stephen St. Germain | 2015-06-30 |
| 8384206 | Semiconductor package | Stephen St. Germain, Frank Tim Jones | 2013-02-26 |
| 7935575 | Method of forming a semiconductor package and structure therefor | Stephen St. Germain, Frank Tim Jones | 2011-05-03 |
| 7495323 | Semiconductor package structure having multiple heat dissipation paths and method of manufacture | Stephen St. Germain, Phillip Celaya, Francis J. Carney | 2009-02-24 |