Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417957 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Stephen St. Germain, Roger M. Arbuthnot | 2025-09-16 |
| 12278158 | Leadframe spacer for double-sided power module | Yong Liu, Liangbiao CHEN | 2025-04-15 |
| 11842942 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Stephen St. Germain, Roger M. Arbuthnot | 2023-12-12 |
| 11830784 | Leadframe spacer for double-sided power module | Yong Liu, Liangbiao CHEN | 2023-11-28 |
| 11282764 | Structure and method related to a power module using a hybrid spacer | Liangbiao CHEN, Yong Liu, Stephen St. Germain, Roger M. Arbuthnot | 2022-03-22 |
| 11121055 | Leadframe spacer for double-sided power module | Yong Liu, Liangbiao CHEN | 2021-09-14 |
| 10741644 | Semiconductor devices with via structure and package structures comprising the same | Shiau-Shi Lin, Hsin-Chang Tsai | 2020-08-11 |
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Hsin-Chang Tsai, Peng-Hsin Lee, Shiau-Shi Lin | 2018-08-21 |