Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205934 | Electronic component package and manufacuring method thereof | — | 2025-01-21 |
| 12113008 | Semiconductor chip package including lead frame and manufacturing method thereof | — | 2024-10-08 |
| 10978403 | Package structure and method for fabricating the same | Liang-Cheng Wang | 2021-04-13 |
| 10741644 | Semiconductor devices with via structure and package structures comprising the same | Tzu-Hsuan Cheng, Hsin-Chang Tsai | 2020-08-11 |
| 10573618 | Package structures and methods for fabricating the same | — | 2020-02-25 |
| 10056319 | Power module package having patterned insulation metal substrate | Chia-Yen Lee, Hsin-Chang Tsai, Peng-Hsin Lee, Tzu-Hsuan Cheng | 2018-08-21 |