| 11315857 |
Package structures |
— |
2022-04-26 |
| 11189555 |
Chip packaging with multilayer conductive circuit |
— |
2021-11-30 |
| 11049796 |
Manufacturing method of packaging device |
Hsin-Chang Tsai, Chia-Yen Lee |
2021-06-29 |
| 10892210 |
Package structures |
Hsin-Chang Tsai |
2021-01-12 |
| 10685904 |
Packaging device and manufacturing method thereof |
Hsin-Chang Tsai, Chia-Yen Lee |
2020-06-16 |
| 10424508 |
Interconnection structure having a via structure and fabrication thereof |
Hsin-Chang Tsai |
2019-09-24 |
| 10056319 |
Power module package having patterned insulation metal substrate |
Chia-Yen Lee, Hsin-Chang Tsai, Shiau-Shi Lin, Tzu-Hsuan Cheng |
2018-08-21 |
| 9905439 |
Power module package having patterned insulation metal substrate |
Hsin-Chang Tsai, Chia-Yen Lee |
2018-02-27 |
| 9865531 |
Power module package having patterned insulation metal substrate |
Hsin-Chang Tsai, Chia-Yen Lee |
2018-01-09 |
| 9847312 |
Package structure |
Hsin-Chang Tsai |
2017-12-19 |
| 9748165 |
Packaging structure |
Hsin-Chang Tsai |
2017-08-29 |
| 9431327 |
Semiconductor device |
Hsin-Chang Tsai, Chia-Yen Lee |
2016-08-30 |
| 9385070 |
Semiconductor component having a lateral semiconductor device and a vertical semiconductor device |
Hsin-Chang Tsai, Chia-Yen Lee |
2016-07-05 |
| 9275982 |
Method of forming interconnection structure of package structure |
Chia-Yen Lee, Hsin-Chang Tsai |
2016-03-01 |
| 9209164 |
Interconnection structure of package structure and method of forming the same |
Chia-Yen Lee, Hsin-Chang Tsai |
2015-12-08 |
| 9177957 |
Embedded packaging device |
Hsin-Chang Tsai, Chia-Yen Lee |
2015-11-03 |
| 8912663 |
Embedded package structure and method for manufacturing thereof |
Chia-Yen Lee, Hsin-Chang Tsai |
2014-12-16 |
| 8764052 |
Airbag device |
Kazuki Funakura, Tomiharu Yamada, Koutarou Yamanaka, Naotoshi Ota, Marius Cociuba |
2014-07-01 |